Vishay Launches New Compact Top-Side Cooled Thick Film Power Resistor in TO-263 (D2PAK) Package

Malvern, Pennsylvania, USA — Shanghai, China — October 13, 2026 — Vishay Intertechnology, Inc. today announced the launch of a new automotive-grade, top-side cooled thick film power resistor — the D2TO35S. The device features a surface-mount TO-263 (D2PAK) package that improves thermal performance while reducing board space requirements, offering power dissipation up to 35 W at 25 °C case temperature for a variety of automotive applications.

As thermal constraints increasingly become the primary bottleneck in system design, many power devices are shifting from PCB substrate cooling to top-side cooling architectures. The D2TO35S conducts heat directly to a heatsink. With a suitable heatsink, its power dissipation can reach up to 9 times that of standard PCB-mounted devices. Leveraging the device's compact surface-mount design, designers can increase power dissipation within the same footprint, or achieve the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on surrounding components, and improving overall system reliability.

The D2TO35S features a non-inductive design that improves signal integrity under fast transient conditions as well as power handling capability. The resistor offers a resistance range from 4.7 Ω to 550 kΩ, tolerance as low as ±1%, thermal resistance of 4.28 °C/W, temperature coefficient of resistance (TCR) of ±150 ppm/°C, and an operating temperature range from -55 °C to +175 °C. The device is RoHS-compliant and performs reliably under 270 °C/10 s reflow soldering conditions.